Probo No.55 Details Probo No.55 Details

Technical Paper

Photonic integration based on a ferroelectric thin-film platform

Author	Advantest Laboratories, Ltd. Shunsuke Abe others
Summary	Photonic-integrated circuits (PICs) using ferroelectric materials are expected to be used in many applications because of its unique optical properties such as large electrooptic coefficients. In this study, a novel PIC based on a ferroelectric thin-film platform was designed and fabricated, where high-speed optical modulator, spot-size converters (SSCs), and a variable optical attenuator (VOA) were successfully integrated. A ferroelectric lanthanum-modified lead zirconate titanate (PLZT) thin film was epitaxially-grown by using a modified solgel method, and it exhibits large electro-optic coefficients (>120 pm/V) and low propagation loss (1.1 dB/cm). The optical modulator, a Mach-Zehnder type, exhibited a half-wave voltage (V_π) of 6.0 V (V_πL=4.5 Vcm) and optical modulation up to 56 Gb/s. Also, the VOA (with attenuation range of more than 26 dB) was successfully integrated with the modulator. As a result, it is concluded that the developed ferroelectric platform can pave the way for photonic integration.
Key Words	Not Specified

A novel memory test system with an electromagnet for STT-MRAM testing

Author	Sales Group, System Solution Division, Memory SE Department, GMS Section Ryo Tamura others
Summary	We have successfully developed, for the first time, a new memory test system for STT-MRAM at wafer-level where an electromagnet is combined with a memory test system and a 300 mm wafer prober. In the developed memory test system, an out-of-plane magnetic field up to ±800 mT can be applied on 10 x 10 mm² in the 300 mm wafer with distribution of less than 2.5%. We demonstrated that the electromagnet can apply large enough magnetic field to evaluate magnetic immunity properties for STT-MRAM using 2Mb STT-MRAM; magnetic field dependence of pass-bit rate for "0"/"1" states, read/write shmoo, and "0"/"1" retention. All the properties can be explained by general theory for STT-MRAM. The developed memory test system with the electromagnet is a key testing tool for STT-MRAMs, which will contribute to increase efficiency of STT-MRAM testing as well as widening the application area of STT-MRAM sensitive to an external magnetic field.
Key Words	Not Specified

Development of digital controlled technology for high voltage DC testing

Author	ATE Business Group, Technology Development Group, Technology Development Division, 8th R&D Department, DC Core Engineering Section Takahiko Shimizu others
Summary	In recent years, the demand for low power devices has increased due to issues related to global environmental protection. As a result, the demand for high-voltage power devices has also increased. To test such devices, test equipment that can handle high-voltage devices (hereinafter referred to as “test equipment”) is required. In addition, test time must be shortened to reduce manufacturing cost. In the past, however, because the voltage to be applied was high, it was a problem that the settling time to reach the targeted voltage increased. In this paper, we focused on the advantage of digital controlled technology that reduces testing time.
Key Words	Settling time, digital control, time-varying control, stack connection, channel collaboration

Metrology at Automated Test Equipment Manufacturers

Author	Advantest Europe GmbH ATE Business Group 93000 Business Unit Piotr Skwierawski others
Summary	New technologies require an efficient qualification infrastructure to determine and qualify technical specifications. Metrology is the science which determines the acknowledged specification setting process based on proven international standards. This paper describes Metrology and its role and benefits in Automated Test Equipment business.
Key Words	Metrology

Technical Description

Development of an Air-Cooling Active Thermal Control Function for M4841

Author	DH Business Group, DH Development Division, DT Development Department, Advanced Technology Development Section Yuya Yamada others
Summary	In recent years, the amount of heat generated during the testing of semiconductor devices for automobile use (hereinafter referred to as “automotive devices”) has increased with the enhancement of their performance. For automotive devices, testing in a wide temperature range (i.e., from low to high temperatures) is required. In addition, active thermal control (ATC), which controls temperature rise due to the self-heating of devices, is required. This article provides an explanation of the “air-cooling ATC function” to be equipped on the test handler M4841 (Figure 1), which is capable of compatibly applying a wide range of temperature (from -55℃ to +175℃) and the function of ATC.
Key Words	Not Specified

Development of a CMOS Image Sensor Capture Module for MIPI D-PHY/C-PHY

Author	ATE Business Group, T2000 Business Unit, ADT Product Unit, ADT Development Department, ISD Development Section Yuji Ariyama
Summary	With the increase in the smartphone camera resolution in recent years, the image data transfer rates of CMOS image sensor (CIS) devices have also increased. Interfaces for image transfer have started to employ MIPI C-PHY in addition to the conventionally mainstream MIPI D-PHY. In this study, we developed a 4.8Gbps image sensor capture module (4.8GICAP) that can measure CIS devices employing such interfaces.
Key Words	Not Specified

Application

Generation of C-PHY signals and UI jitter with 8GDM

Author	Sales Group System Solution Division T2000 SE Department CIS Section Kengo Suzuki
Summary	To inspect 4.8-Gbps CMOS image capture modules (4.8GICAP) that are based on MIPI C-PHY interfaces, ADVANTEST developed a method of using three-level driver patterns and the timing edge-shift function of 8-Gbps digital modules (8GDM) to generate C-PHY signals and apply jitter. This article describes prior knowledge on the use of 8GDM as a source of C-PHY signals and the challenges and solutions related to this technology.
Key Words	Not Specified