No.62 (September, 2024)
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* Author positions and job titles are valid at time of submissions and not necessarily current.
Technical Paper
| Title/Author |
|---|
| Mechanism of low-temperature-annealed Ohmic contacts toAlGaN/GaN heterostructures: a study via formation and removal of Ta-based Ohmic-metals Advantest Laboratories Ltd. Kazuya Uryu others |
| Development of a Die Carrier that enables testing of HBM’s individual bare dies DH Business Group, NTC Development Department, NHS Development Section Toshiyuki Omuro others |
Application
| Title/Author |
|---|
| Development measuring method of NAND interface SCA protocol on T5835 Sales Group, System Solution Division, Memory SE Department, GMS Section Toru Kushida others |