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Technical Paper
Fabrication of vertical-taper structures for silicon photonic devices by using local-thickness-thinning process
| Author | Advantest Laboratories Ltd. Shunsuke Abe others |
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| Summary | This paper describes a simple fabrication process of verticaltaper structures which can locally tune the thickness of silicon photonic devices. For low-loss spot-size conversion, taper angles less than 10° are required. To fabricate the gradual-slope shape of the vertical tapers, we have developed a step-andexposure lithography process, which is realized by repeated light exposure to photoresist and movement of the wafer stage by using commercial steppers. The process is conducted at a lower temperature (~120°C) than the conventional process and is compatible with the CMOS process. Also, we have made a model of the lithography to predict the angle of the taper. Theoretical angles are consistent with the experimental results. We demonstrate the conversion of a 400-nm-thick silicon waveguide to 220 nm, whose length was 2.4 μm and insertion loss was measured to be less than 0.3 dB. The process enables to choose the optimal thickness for each silicon-photonic device. |
| Key Words | Not Specified |
Low-profile Water-cooled Cold Plate
| Author | DH Mechanical Technology Section DH MechanicalTechnology Department DH Development Division DH Business Group Yasufumi Yoda others |
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| Summary | Test system performance has been improved, and the heat generation density of electronic circuit boards and their mounting density in the test system chassis are also on the rise. In addition, the recent SDGs are driving the need to develop products with low environmental impact. In response to social and technological demands, we have developed a high-performance, low-profile water-cooled cold plate for cooling electronic circuit boards. |
| Key Words | cold plate, low-profile, low environmental impact, pressure loss, adhesion |
Application
Improvement of High-Gradation DDIC Device Test Yield by T6391 High-Accuracy Measurement Solution
| Author | Advantest Taiwan Inc. Jiro Noda others |
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| Summary | For DDIC (Display Driver IC) for OLED (Organic Light Emitting Diode) displays for smartphones and IT displays (tablets, laptops) and head mounted displays for AR (Augmented Reality)/ VR (Virtual Reality), the output voltage will be divided into more highly-defined steps than in the past. In order to measure the output voltage of the leading-edge DDIC with high accuracy, we developed a new per-pin digitizer and comparator module “LCD HP” and reduced noise and measurement deviation between channels. In this paper, we present its test performance. |
| Key Words | Not Specified |