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SoC Test System

Leading-edge Technology Meets the Extreme Test Challenges of the Age of Convergence and Exascale Computing

Today’s most advanced semiconductor processes allow for technology transformations that enable real-time integration of data from a countless number of sources such as IoT and handheld devices, automobiles and large servers to name a few. As mobile processors, high-performance computing (HPC) and artificial intelligence (AI) ICs evolve, the amount of data being processed continues to grow exponentially. Along with these advancements, new testing challenges, including very high scan-data volumes, extreme power requirements, fast yield-learning, and high-multisite configurations, need to be addressed. Advantest’s new V93000 EXA Scale generation addresses these challenges with innovative advancements on the proven V93000 architecture.

The new V93000 EXA Scale™ SoC Test Systems are targeted at advanced digital ICs up to the exascale performance class. The systems’ new test heads incorporate Xtreme Link™ technology, and the EXA Scale universal digital and power supply cards that enable new test methodologies, lower cost-of-test and faster time-to-market.

High Integration Technology

16 fully independent pins in smallest form factor: 16 high speed cores, MIPS processors, DSP cores.

All EXA Scale cards are designed with the latest generation of Advantest’s test processors with 8 cores per chip, featuring unique capabilities to speed up and simplify test execution.

With 256 channels on the Pin Scale 5000 digital card and XPS256 power supply card, the density is doubled, while maintaining the industry-leading V93000 highly integrated form factor. High-multisite configurations can be implemented in smaller physical systems, reducing infrastructure cost and floor-space requirements.