Probo No.39 Details
Technical Paper
VPCS "Vacuum probe contact system"
Author | New Concept Product Initiative NPX Project Takashi Naito others |
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Summary | The need to reduce costs has for years been driving the demand for a wafer-batch-contact test. Process refinement has increased the number of dies per wafer, and also the thrust required to secure good contact. To achieve satisfactory batch contact involves issues such as the higher thrust and rigidity of the probe device, and improved parallelism between the probe card and the wafer chuck. This paper introduces a technology that allows a thrust sufficient for an existing probe to be used with the 450 mm wafer generation, allowing both a reduction in cost and high reliability. |
Key Words | Not Specified |
Elegant Construction of SSC Implemented Signal by AWG And Organized Under-sampling of Wideband Signal
Author | System Solution Group SoC System Engineering COE(Center Of Expertise) Hideo Okawara |
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Summary | Implementing a SSC (Spread Spectrum Clocking) solution is not an easy task for digital resources to generate and analyze. In contrast, analog resources in mixed signal testers can easily take care of such signals. The purpose of this work is to establish organized methodologies to generate and analyze the SSC implemented signal by using an AWG (Arbitrary Waveform Generator) and a waveform sampler. The first section describes the FFT (Fast Fourier Transform) & IFFT (Inverse FFT) method which provides an elegant method to construct a SSC high-speed digital data stream using an AWG. The second section describes an under-sampling method to analyze wideband signals such as a SSC high-speed digital signal by using a waveform sampler. A practical example shows a data stream of a 1.5Gbps SATA (Serial ATA) with a 30ms triangle profile SSC period. |
Key Words | Not Specified |
Technical Description
Development of termination voltage amplifier for 10Gbps CML PE-Driver
Author | Technology Development Group 3rd R&D Department Masashi Watanabe and others |
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Summary | PE-driver/comparator IC operating at 10Gbps was developed to be compatible to test devices which has high-speed serial I/F. For driver circuit, the CML system is chosen and the circuirt architecture has been devised in order to satisfy both high density and high accuracy. This paper introduces the design method, focusing on the termination voltage amplifier which is one of the circuits so crated, and the development results for the driver. |
Key Words | Not Specified |
Development of wide band range, High-density and High-speed Transmission Connector for HIFIX
Author | DI Business Division DI R&D Department Hirotaka Wagata |
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Summary | In recent years, the demands for higher-speed devices and multiple-device parallel measurements have created a great need for a connector that allows wideband, high-density, and highspeed transmission. We have developed a wideband, high-density, low-crosstalk, low-reflection HIFIX connector with a bandwidth up to 20 GHz, and which can serve as a HIFIX interface for measurement of a 10 Gbps or higher-speed SoC device and a high-speed memory device. This paper introduces this HIFIX connector. |
Key Words | Not Specified |
Low COT Tester Technology for Memory Core Testing
Author | Memory Test Business Group 7th R&D Department Masaru Doi |
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Summary | To test a high-speed memory device such as DDR3-SDRAM, a 2-pass method comprising a high-speed I/O test and a lowspeed memory core test is used in most cases. Because the memory core test requires a long time, it requires several times as many testers as the I/O test does. In the wake of a decline in the unit price of a DRAM device in recent years, a low COT (Cost Of Test) solution is urgently required for the memory core test, which specifically needs the larger number of testers. We have extensively reviewed the conventional tester structure and have developed an ETM (Enhanced Test Module) structure, thereby realizing a low COT, easy upgrade, power saving, and space saving. |
Key Words | Not Specified |
Application
Test technology of IGBT on T2000
Author | System Solution Group SoC System Engineering Solution Development Hideo Yasuda |
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Summary | In recent years, with efforts underway to reduce CO2 and save energy, a power semiconductor in an industrial vehicle field has come to be widely used in many devices, from consumer electronics to computers, automobiles, railways and more, and this use is expected to grow steadily. This paper introduces an IGBT measurement technology that uses the T2000 IGBT test solution that has been developed to allow mass production testing of this power semiconductor device. |
Key Words | Not Specified |
The performance of T5511 Timing-Training hardware
Author | System Solution Group Memory System Engineering Global Operation Yuiko Ushirogi |
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Summary | The T5511 is the high-end model of memory test system that operates up to 8 Gbps. An ultra high speed memory device such as GDDR5 SGRAM is assumed to be its primary target device. For GDDR5 SGRAM testing, timing training is required. Conventional memory testers require a long execution time due to software processing. The T5511 is newly provided with a timing training function that allows fast processing. This paper presents the effectiveness of the timing training function on the basis of actual testing of GDDR5 SGRAM. |
Key Words | Not Specified |
Test Technology Enabling Multiple-Device Parallel Testing of Motion Sensors
Author | Advantest Kyushu Systems Co., Ltd. Junichi Hikosaka and others |
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Summary | In late years a motion sensor market sensing magnetism, acceleration, an angle spreads. The magnetic sensor which was a representative motion sensor has been equipped with in motor rotary control region of a cooling fan and the DVD drive of a body control unit and the PC of the car until now. The amount of production of the motion sensor increases rapidly by the deployment to a cell-phone and a smartphone recently, and, in addition to them, a reduction in cost demand rises at the same time. This report introduces the test technology that enabled a large test cost cut in the mass production process of the motion sensor. This technique was developed as a function of 10MHz digital module (10MDM) for analog tester T7912A. |
Key Words | Not Specified |