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Technical Paper
Statistical Silicon Results of Dynamic Power Integrity Control of ATE for Eliminating Overkills and Underkills
| Author | Technology Development Group 5th R&D Department FT Technology R&D Section 2 Takashi Kusaka others |
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| Summary | This paper demonstrates our dynamic power integrity control for eliminating the overkills/underkills due to the difference of power supply impedance between an automatic test equipment (ATE) and a practical operating environment of the device under test (DUT).It injects compensation currents into the power supply nodes on the ATE system in a feed-forward manner such that the ATE power supply waveform matches with the one on the customer’s operating environment of the DUT. Experimental results of delay fault testing with 105 real silicon chips show that 48% of overkills/underkills due to the different power supply characteristics can be eliminated by our dynamic power integrity control. Furthermore, it was found that adjusting the magnitude of the power integrity control based on the chip-to-chip active power variation improves the correlation of the test results between the ATE and the customer environment, resulting in 95% of the overkills/underkills can be eliminated. |
| Key Words | Not Specified |
Three dimensional profile measurement using multi-channel detector MVM-SEM
| Author | Nanotechnology Business Division Second Product Development Department Software Development Section Makoto Yoshikawa others |
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| Summary | In next generation lithography (NGL) for the 1x nm node and beyond, the three dimensional (3D) shape measurements such as side wall angle (SWA) and height of feature on photomask become more critical for the process control. Until today, AFM (Atomic Force Microscope), X-SEM (crosssection Scanning Electron Microscope) and TEM (TransmissionElectron Microscope) tools are normally used for 3D measurements, however, these techniques require time-consuming preparation and observation. And both X-SEM and TEM are destructive measurement techniques. This paper presents a technology for quick and non-destructive 3D shape analysis using multi-channel detector MVM-SEM (Multi Vision Metrology SEM), and also reports its accuracy and precision. |
| Key Words | Not Specified |
An ATE Based 32 Gbaud PAM-4 At-Speed Characterization and Testing Solution
| Author | Advantest Europe GmbH 93k HW BBN José Moreira others |
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| Summary | In this paper we will describe a solution to test I/O cells that use four level pulse amplitude modulation (PAM-4) at data rates of 32 Gbaud using a commercial ATE platform without any external instruments. The solution is based on an active test fixture where a retimed digital to analog converter (DAC) is used to generate the PAM-4 stimulus signaling. The comparator side is implemented using a single differential comparator and three consecutive functional tests with different patterns and compare threshold voltages. |
| Key Words | Not Specified |
Application
Embodiment of Efficient Test Program Development Environment in T2000
| Author | Software Development Group 5th Software Department SoC Software Section 1 Hironori Maeda others |
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| Summary | T2000 and its operating environment, T2000 System Software (TSS), were originally developed aiming at accessing the Automatic Test Equipment (ATE) market for microprocessors (MPUs) and at the embodiment of an open architecture ATE. While those objectives seemed to have been achieved, usability issues of the TSS came to the fore as T2000 came to provide various instrument modules and was applied to variety of devices and test methods. Specifically, the programming and debugging of test programs were said to be hard, and a solution for them was needed. In order to meet such needs, Advantest developed an integrated test program development environment, namely, Test Program IDE (or TPIDE for short) on Microsoft® Visual Studio®. And this time we developed a highly efficient development environment that eliminates the border between programming and debugging processes in the test program development, achieved by closed cooperation among TSS, TPIDE and GUI tools. |
| Key Words | T2000 System Software, OTPL, Programming, Debugging, Test Program IDE |
Development of Device Interface and Probe Card for Image Sensor Tests to achieve 3Gbps Data Transmission
| Author | FormFactor Inc, Special Product Group Minoru Mikami Others |
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| Summary | Recently, the interface speed of image sensors is getting faster with increasing image sensor sizes. To measure these high speed image sensors in true speeds, the signal integrities from devices to test systems are critical. Especially, the probe card which contacts devices and pull out signals hardly achieves broad band data transmissions. This paper reports mainly the result of development of probe cards which have 3Gbps bandwidth achieved by Form Factor Inc. |
| Key Words | Signal Integrity, Probe Card, Device Interface, Image Sensor Test, Performance Board, Pogo Tower |