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Technical Paper
Novel Crosstalk Evaluation Method for High-Density Signal Traces Using Clock Waveform Conversion Technique
| Author | Business Innovation Group Architecture Development Department Takayuki Nakamura others |
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| Summary | Today, as LSI devices are increasingly more integrated resulting in larger number of package pins, high speed signal lines are more easily coupled to each other. Additionally, since multisite testing is required to reduce the cost of test, the transmission lines connecting these pins become even more concentrated. To measure these LSI devices, a huge number of high-speed transmission lines are required in the test board. Therefore minimizing crosstalk is very important. Furthermore, since the number of channels have reached more than ten thousand in recent evaluation systems, it is strongly required that the crosstalk from all channels be measured. With so many channels, measuring crosstalk with traditional methods will at best be very time-consuming or at worse, completely impractical, as it requires either a large number of pulse generators or physical reconnections depending on measurement type. In this paper, we propose a very fast and low cost crosstalk measurement method, which can acquire results very quickly and with high frequency resolution. Only a single measurement makes it possible to evaluate the crosstalk over a wide frequency band without the repetition of manually measuring at each frequency. This method is highly beneficial to the automatic test equipment (ATE) environment with high density transmission lines on the performance boards or load boards. |
| Key Words | Not Specified |
Power Supply Impedance Emulation to Eliminate Overkills and Underkills due to the Impedance Difference between ATE and Customer Board
| Author | Technology Development Group 5th R&D Department FT Technology R&D Section 2 Masahiro Ishida other |
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| Summary | This paper proposes a new type of power supply circuit for automatic test equipment (ATE) that has ability to emulate arbitrary power supply impedance. It can emulate power supply impedance of customer environment so as to match the power supply voltage fluctuation waveforms of the ATE and of the customer environment, in order to eliminate overkills/underkills coming from the voltage fluctuation difference caused by the impedance difference between the ATE and a practical operating environment. Our technique adjusts the equivalent impedance by injecting compensation current by a current source attached in parallel with the power supply source. The compensation current is calculated and injected in realtime with a feedback manner based on the power supply voltage measurement with the impedance characteristics of ATE's original power delivery network (PDN) and the customer PDN. Experimental results of prototype circuits are demonstrated to show that the compensation current emulates the impedance, and the both power supply voltage fluctuation waveforms agree well. Limitations and applications of our method are also discussed. |
| Key Words | Not Specified |
An Optical Interconnection Test Method Applicable to 100-Gb/s Transceivers using an ATE based Hardware
| Author | ADS Business Group ADT Product Unit OTS Project Kazuki Shirahata other |
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| Summary | Drastically increasing network traffic within datacenters requires high volume manufacturing of 100-Gb/s optical transceivers. This paper proposes a high throughput test method for optical transceivers using Automated Test Equipment (ATE) with both an optical and an electrical frontend. By using proposed solution 4.4 times higher throughput can be achieved. |
| Key Words | high speed optical interconnection, ATE, high speed electrical interface, 100-Gb/s ethernet, QSFP, optical transceiver |
Technical Description
The elemental technologies for multi-site test of RF IC by V93000
| Author | Technology Development Group 9th R&D Department RST R&D Section Hideki Shirasu other |
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| Summary | This article describes the development of test solution for highly integrated RFICs. The objective of the base instrument was to push density . and with it parallelism . of RF testing in order to increase efficiency of multi-site capability. It must still be able to measure latest communication standards like for example IEEE 802.11ac, 4G or LTE Advanced and also is expected extended performance such as low phase noise to satisfy even more demanding applications. The paper deals with the key technologies to realize them. |
| Key Words | Not Specified |
Application
M4871/72 temperature control solution for High-Power Device
| Author | FA Division Product Engineering Department Electrical Module Development Section Katsuhiko Watanabe other |
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| Summary | In the market more precise and faster junction temperature control is required for testing high heat generating high-power devices such as GPUs and processers for servers. The temperature control in a general handler has no means to measure junction temperature Tj directly and it is very difficult for previous method to dissipate high power from the device. For these reasons, we developed the interface board to measure Tj, the thermal head to dissipate the high power from the device, and the fast response temperature control algorithm. In this paper, we provide our temperature control solution to manage Tj precisely with Tj feedback, by a technology that utilizes Tj interface board and fast response temperature control algorithm and high power dissipation thermal head. |
| Key Words | Not Specified |