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The system accurately analyzes the wiring quality of various leading-edge semiconductor packages such as Flip Chip BGA, wafer level packages, and 2.5D/3D ICs using terahertz technology. It is a TDR analysis system that has the world’s top-class signal quality.

Introduction of Products
Feature
Main Functions/Specifications
Software

TS9001 TDR system

Can be connected to various kinds of probers!

It can be connected to a radio-frequency probing system that you own or have selected, providing flexible solutions that match your device shape and fault analysis environment.

TS9000 series TDR option

An automatic probing mechanism is included as a standard feature!

A probe station is included as a standard feature, which allows the automatic probing of pad coordinates with a measurement distance of up to 300 mm.

Feature

As semiconductor packages grow smaller and become more highly integrated, there is a growing need to locate faults non-destructively and with a high degree of precision. Therefore, it is necessary to have a system that can easily create the optimal analysis environment according to diverse fault analysis conditions.

The TDR analysis of the TS9000 series TDR option and the TS9001 TDR system conducts rapid, high-precision, and non-destructive analysis of faulty areas of the wires in cutting-edge semiconductor packages, electronic components, and printed boards by performing high-resolution TDR measurement (time domain reflectometry) utilizing our proprietary short pulse signal processing technology.

Capable of conducting a fault analysis for 2.5D_IC and 3D_IC
- ・Resolution for faulty area detection: < 5μm
- ・Maximum measurement distance: 300mm
Automated TDR measurement
By using the auto touch-down function of the auto prober, the system conducts precise and reproducible measurements, contributing to the reduction of human errors.
DUT temperature control available (TS9001 + external prober connection)
（Example）SUMMIT200 by FFI (high/low temperature model: -60 ℃ to 300 ℃)
A variety of analysis software available
Failure Position Viewer, which indicates the faulty areas on the CAD data, is provided. (Optional)

TDR Measurement Utilizing THz Technology

Problem in fault analysis using the oscilloscope TDR　⇒　Large error gap in locating fault points

Step response waveforms are used for the probe signals used for the analysis.
The starting points of the amplitude change of the TDR waveforms obtained from good and faulty products are identified as fault points. However, the starting points are unclear, so there is a large error gap in locating the fault points.

By using impulse waveforms for probe signals, fault points are identified easily at pulse peaks (intuitively).

**Example of TDR measurement with TS900x**
Observes fault points as peaks

**Example of oscilloscope TDR measurement**
The starting points of the amplitude change are unclear.

Fault analysis of highly integrated LSI packages

Fault analysis of the wiring in packages

Determines whether a wiring fault point is in the Si Interposer or the package
Identifies whether the fault was caused by a factor in the pre-process or post-process

Si Interposer mounting (C4 Bump) fault analysis

Identifies and analyzes the conditions for mounting the Si Interposer by using a test vehicle
Performs fault point analysis of the daisy chain structure on the test vehicle and gives feedback to the mounting conditions.

Laminated memory mounting (TSV, Micro-Bump) fault analysis

Identifies faulty layers of a laminated chip

Wiring fault analysis of printed boards

Identifies fault points of the vias and signal lines in stacked boards

Fault analysis of Small-BGA

Performs a TDR analysis by forming open faults in the through hole, wiring, and bonding wire in a board
Detects the reflected pulse from a fault point even in packages with a complicated structure

Main Analysis Cases

For fault analyses in TSV and other minute vias or between bumps
For temperature dependency analyses of faults in contact points
For analyses of high-resistance faults, which appear as minute differences between waveforms

1	Board	Microstrip line	Open
		Microstrip line	Short
		Transmission line	Open
		Transmission line	Short
2	QFP	Bonding wire	Open
2	QFP	Bonding wire	Short
3	small-BGA	Bonding wire	Open
		Through hole in a board	Open
		Wiring in a board	Open
4	FCBGA	Bump	Open
		Daisy chain	Open
		Daisy chain	Short
		Bump	High resistance
		Near to bumps (Length: <1mm）	Open

Main Functions/Specifications

*1

The maximum measurement distance when the effective dielectric constant of the transmission line to be measured is 3.

*2

Number of integration: 1024, Probe contact time not included

*3

The minimum pad that can be monitored by the camera. The minimum pad that the system can contact depends on the probe used.
The minimum contact pad of ACP110 (RC option) by FormFactor, which we recommend, is 40 μm × 70 μm.

*4

@ Time domain: 0 to 800 ps, accumulated 16384 times

*5

@ Time domain: 800 to 1500 ps, accumulated 16384 times

*6

These are the specifications when Prober SUMMIT200 by FormFactor is used.

*7

It may be restricted by the operating temperature range of the probe used. The operating temperature range of ACP110 by FormFactor, which we recommend, is from -65 to +200 ℃.

*8

Optional. Product code: PYTE01-21MAIS
Item		TS9000	TS9001
TDR system performance	Resolution for faulty area detection	5μm	5μm ^4, 10μm ^5
	Rise time	12ps
	Max. measurement distance ^*1	300mm	100mm
	Measurement time ^*2	300sec/point	30sec/point
Prober performance	Prober	Original prober	Prober from other companies ^*6
	Min. pad ^*3	100μm	50μm ^*6
	Probing method	Automatic	Automatic ^*6
	Stage position reproducibility	10μm	1.5μm ^*6
	Stage movable area	150×150mm	203×203mm ^*6
	Sample temperature	Room temperature	Select from the following temperature ranges. ^*6,7 Room temperature, Room temperature to +200℃, or -60 to +200℃
Analysis software PC	TDR Analyzer	Mounted
	TDR CAD DATA LINK	Optional ^*8
	Analysis PC	Provided as a standard feature (OS: Windows 10 Pro. 64-bit)
General specifications	Guaranteed performance range	Temperature range: 23±5℃　 Relative humidity: 80% or less (with no condensation)
	Operating environment	Temperature range: +10 to +30℃ Relative humidity: 80% or less (with no condensation)
	Storage environment	Temperature range: -10 to +50℃ Relative humidity: 80% or less (with no condensation)

*1

A function when CAD Data Link option (PYTE01-21MAIS) is used
	Function
Analysis function	Analyzes fault point extractions (open, short, and impedance mismatch) from the measurement data easily Displays differences from normal product data Peak search Calculations (e.g., deconvolution, smoothing) Displays a marker and cursor on a waveform
Analysis function	Visual analysis that links the analysis data with CAD data1 ^*1 Predicted fault position displayed on the CAD data Support for multiple branches Indication by layer
External output function	Output of the measurement data to a CSV file

The TS9000 series TDR option and TS9001 TDR system are equipped with TDR Analyzer as a standard feature. It also has an integration function and supports step waveform analysis (oscilloscope observation).
In addition, by using the TDR CAD Data Link option, faulty areas on the CAD wiring data can be mapped, which makes it easier to deduce the cause for the faults.

Basic functions and usage examples of TDR Analyzer

Basic functions

Waveform calculation function Scaling & offset, smoothing, four arithmetic operations, differential, integral, and normalization
Marker function
- Indication of the amplitude, time, and distance of a marker position
  Effective dielectric constant specified:
  Calculate the distance from the time
  Distance specified:
  Calculate the effective dielectric constant from the time
- Peak detection
  Detection by specifying a peak threshold and detection through the rising/falling edge Marking of multiple reflected points

Usage example 1. Normalization calculation

By aligning the waveform levels and phases of the reference (good product) and sample (faulty product) and obtaining the difference, it is possible to extract only the characteristics of the sample waveform.
The waveform characteristics that are common between good and faulty products are canceled, which emphasizes only the characteristics of the faulty product.

Usage example 2. Peak detection function

Finds peaks that meet the conditions from the waveform and displays markers on the waveform. Detecting the peaks makes it easy to locate faults.
Detection is performed by specifying the polarity and threshold value of the peak to be detected. The detected peaks are indicated with markers. The marker positions are displayed in a list.

Basic functions and usage examples of Failure Position Viewer

Loading CAD file ODB++ (advocated by Mentor Graphics Corp. and supported by many industry-leading CAD/CAM vendors)
Specifying TDR measurement positions It is possible to click the PAD position to be measured with a mouse to specify a measurement point.
Visualizing predicted fault positions Supports wiring across multiple layers and branched wires.