ATS 5030 Burn-In Test System

Semiconductor Burn-In Test

MODEL IMAGE

Transform your burn-in testing strategy with the ATS 5030 Burn-in Test (BiT) Platform. This next-generation semiconductor tester offers independent per-site burn-in for semiconductor packaged devices. Deployed globally, the ATS 5030 BiT Platform is a turnkey system that consistently delivers industry-leading thermal stress test for billions of semiconductor devices.

Product Information

This turnkey platform provides:

  • Industry's fastest time to volume and revenue
  • Improved yields
  • Reduced cost of test and total cost of ownership
  • Customized platform for specific device needs
  • Improved efficiency with complete test coverage from digital test to system level test
  • 15+ years of proven success

Achieve Faster Time to Volume & Revenue with the Massively Parallel, Modular Architecture

  • One solution for everything -- programming, validation, test, and performance binning
  • Fully automated or manual handling options with multiple input/output lanes
  • Simultaneous testing of hundreds of devices in parallel
  • Support for virtually any semiconductor package type
  • Modular architecture enables maximum test cost savings per device

Simplify Burn-in with Superior Thermal Test Coverage Plus Digital Test

  • Test up to 32 different work orders, each with its own test recipe of voltage, temperature, burn-in time, and more
  • True Active Temperature Control (ATC) delivers maximum precision with programmable per-site conducted thermal testing
  • Fast thermal transition and responsiveness
  • Upgrade paths for digital test including System-Level Test (SLT)
  • Software Test Reference Design Plugs and Plays with Our Turnkey Platform
  • Customize test plans using the included award-winning ActivATE™ test executive software
  • Real-time monitoring and logging of device temperature, current, and power
  • Multi-threading environment