HiFIX (High Fidelity Tester Access Fixture)

Manual HiFIX

This HiFIX is for manual hand test. It is mainly for use in R&D applications, as in evaluation of devices under development. Its specifications can be tailored to the requirements of the customer. This low-cost, reliable product leverages many years of accumulated knowledge and experience at ADVANTEST.

Wafer HiFIX

This HiFIX supports wafer probers from a variety of companies. Its specifications can be tailored to customer requirements.

 

Cable-Connected HiFIX

Connects the performance board and socket board via coaxial cable, allowing even highspeed devices to be tested with precision. Supported packages include: QFP, CSP (µBGA), and TSOP I/II.

 

SBC-TYPE HiFIX (Socket Board Change)

Using a high-performance coaxial connector developed by ADVANTEST, it allows DUTs to be swapped out by replacing only the socket board. This mechanism facilitates test of high-speed devices, and also leads to reduced cost of test. The SBC-TYPE HIFIX boasts improved transmission performance, and it entails lower costs when swapping devices. Supported packages include: QFP, CSP (?BGA), and TSOP II.

 

eSBC-TYPE HiFIX

Complementing the high-performance SBC HiFIX, this HiFIX brings the SBC method to existing test systems. Using a connector developed by ADVANTEST, it also reduces running costs.
Supported packages include: QFP, CSP (µBGA), and TSOP.

ADVANTEST's IC sockets are designed for use with Advantest-manufactured HiFIX products(*) and deliver fast and flexible support for devices with increased speeds and bit-widths, as well as those with progressively narrower ball/lead pitch.

(*) not available for wafer HiFIX

µBGA/CSP Type (1.5nH)

A pogo pin spring socket, with 1.5 nH impedance, for high-speed devices.

BGA/CSP Socket (1.5nH) Specification

Socket type	POGO PIN SOCKET
Ball pitch	0.75/0.8/1.0mm
Contact resistance (at Au-Pad)	200mΩ or less (at 20K cycle)
Impedance	1.5nH
Contact force	25 to 35 gf/pin
Contact stroke	0.3mm
Service life (mechanical)	100,000 or more
Operating temperature	-55 to +125°C
Device type	CSP/BGA
Shape of contactor

CSP Type (2.3nH,3.0nH)

Spring probe socket supporting DRAM/flash memory.

CSP Socket (for DRAM/flash memory) Specification

Socket type	POGO PIN IC SOCKET
Ball pitch	0.5/0.75/0.8/1.0mm
Contact resistance (at Au-Pad)	200mΩ or less (at 20K cycle)
Impedance	3.0nH	2.3nH
Contact force	20 to 30 gf/pin
Contact stroke	0.35mm	0.25mm
Service life (mechanical)	100,000 or more
Operating temperature	-55 to +125°C
Device type	CSP
Shape of contactor

TSOP/QFP Type

A socket with 1.8 nH impedance and Y-shaped contactor.
An optional protective sheet is available for protection of the socket board on the gold pad.

TSOP/QFP Socket (1.8nH) Specification

Socket type	Y CONTACTOR IC SOCKET
Lead pitch	0.5/0.65/0.8mm
Contact resistance (at Au-Pad)	30mΩ or less (at 10K cycle)
Impedance	1.8nH
Contact force	20 to 40 gf/pin
Contact stroke	0.2mm
Service life (mechanical)	10,000 or more
Operating temperature	-20 to +125°C
Device type	TSOP/QFP
Shape of contactor

BGA/CSP Type (0.4nH)

Leveraging an accumulated expertise in high-speed signal transmission and contact technology, ADVANTEST has this superior IC socket with low impedance and high-frequency characteristics.

BGA/CSP Socket (0.4nH) Specification

Socket type	RUBBER TYPE IC SOCKET
Ball pitch	0.5/0.65/0.8/1.0mm
Contact resistance (at Au-Pad)	200mΩ or less (at 20K cycle)
Impedance	0.4nH or less
Contact force	20 to 30 gf/pin
Operating temperature	-40 to +125°C