ATS 5030 Burn-In Test System
Semiconductor Burn-In Test
Transform your burn-in testing strategy with the ATS 5030 Burn-in Test (BiT) Platform. This next-generation semiconductor tester offers independent per-site burn-in for semiconductor packaged devices. Deployed globally, the ATS 5030 BiT Platform is a turnkey system that consistently delivers industry-leading thermal stress test for billions of semiconductor devices.
Product Information
This turnkey platform provides:
- Industry's fastest time to volume and revenue
- Improved yields
- Reduced cost of test and total cost of ownership
- Customized platform for specific device needs
- Improved efficiency with complete test coverage from digital test to system level test
- 15+ years of proven success
Achieve Faster Time to Volume & Revenue with the Massively Parallel, Modular Architecture
- One solution for everything -- programming, validation, test, and performance binning
- Fully automated or manual handling options with multiple input/output lanes
- Simultaneous testing of hundreds of devices in parallel
- Support for virtually any semiconductor package type
- Modular architecture enables maximum test cost savings per device
Simplify Burn-in with Superior Thermal Test Coverage Plus Digital Test
- Test up to 32 different work orders, each with its own test recipe of voltage, temperature, burn-in time, and more
- True Active Temperature Control (ATC) delivers maximum precision with programmable per-site conducted thermal testing
- Fast thermal transition and responsiveness
- Upgrade paths for digital test including System-Level Test (SLT)
- Software Test Reference Design Plugs and Plays with Our Turnkey Platform
- Customize test plans using the included award-winning ActivATE™ test executive software
- Real-time monitoring and logging of device temperature, current, and power
- Multi-threading environment