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Technical Description Technical Description

Title No.
Development of control system “HC-X” for inteXcell(MC5041) No.60
16 Gbaud PAM3 V93000 BOST solution for GDDR7 No.59
The development of front-end module for 5G millimeter-wave device testing No.58
High-speed Image Processing by GPU No.56
Development of an Air-Cooling Active Thermal Control Function for M4841 No.55
Development of a CMOS Image Sensor Capture Module for MIPI D-PHY/C-PHY No.55
Mass Production Program Automatic Optimization No.54
Development of high-voltage, high-current floating module with a maximum of 320 V and 18 channels No.52
The elemental technologies for multi-site test of RF IC by V93000 No.48
Why Next-Generation NAND Flash Requires a Dedicated Test Solution No.42
Test technology of CMOS image sensor device No.41
Development of termination voltage amplifier for 10Gbps CML PE-Driver No.39
Development of wide band range, High-density and High-speed Transmission Connector for HIFIX No.39
Low COT Tester Technology for Memory Core Testing No.39
Visualization of Handler statistics data - The Way of user-oriented GUI - No.38
Dedicated Nand Flash Memory Tester Technology With New Concept No.38
Development of an ATE Test Cell for At-Speed Characterization and Production Testing No.38

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