| Title | No. |
| Mechanism of low-temperature-annealed Ohmic contacts toAlGaN/GaN heterostructures: a study via formation and removal of Ta-based Ohmic-metals | No.62 |
| Development of a Die Carrier that enables testing of HBM’s individual bare dies | No.62 |
| Fabrication of vertical-taper structures for silicon photonic devices by using local-thickness-thinning process | No.61 |
| Low-profile Water-cooled Cold Plate | No.61 |
| Separation of signal and environmental magnetic noise using independent component analysis | No.60 |
| Breakthrough for Test Cost Reduction on MicroLED Device with Electric-Luminescence and Electrical Test Embedded Solution | No.60 |
| Cherenkov-type phase matched terahertz wave generation from LiNbO3 waveguide using mode-locked fiber laser and optical amplifier | No.59 |
| Software Execution Time Reduced by New Tester-per-Site Architecture Using High-performance CPU | No.59 |
| Test cost reduction according to Adaptive Probe Cleaning | No.59 |
| Open-short Normalization Method for a Quick Defect Identification in Branched Traces with High-resolution Time-domain Reflectometry | No.58 |
| GaN 8Gbps High-Speed Relay MMIC for Automated Test Equipment | No.58 |
| A Calibration Technique for Simultaneous Estimation of Actual Sensing Matrix Coefficients on Modulated Wideband Converters | No.57 |
| High-speed measurement of Piezoelectric MEMS equivalent circuit parameters by Swept-sine and PRBS signals | No.57 |
| Over-the-Air (OTA) Test Socket and Handler Integration Technology for 5G Mass Production Testing | No.57 |
| Study of spatial filter for magnetocardiography measurements without a magnetically shielded room | No.56 |
| Development of High Voltage General-purpose Pin-Electronics | No.56 |
| Photonic integration based on a ferroelectric thin-film platform | No.55 |
| A novel memory test system with an electromagnet for STT-MRAM testing | No.55 |
| Development of digital controlled technology for high voltage DC testing | No.55 |
| Metrology at Automated Test Equipment Manufacturers | No.55 |
| A 40 GHz Linear Driver Amplifier for Optical ATE using GaN HEMT with InGaN Back Barrier | No.54 |
| Ultra-Wideband Modulation Signal Measurement Using Local Sweep Digitizing Method | No.54 |
| Estimation of fogging effect in E-Beam direct writer for photonic crystal pattern | No.54 |
| A Review of Combiner/Divider PCB Design Topologies For 5G and WiGig ATE Applications | No.53 |
| A Jitter Injection Module for Production Test of 52-Gbps PAM4 Signal Interfaces | No.53 |
| Magnetocardiography measurements by using active magnetic canceller | No.53 |
| High-resolution Time-domain Reflectometry Analysis in Back-end-of-line (BEOL) by Recursive Circuit Modelling | No.52 |
| Drain-induced barrier lowering in normally-off AlGaN-GaN MOSFETs with singleor double-recess overlapped gate | No.51 |
| A Stressed Eye Testing Module for Production Test of 30-Gbps NRZ Signal Interfaces | No.51 |
| Accurate error bit mode analysis of STT-MRAM chip with a novel current measurement module implemented to gigabit class memory test system | No.51 |
| Photonic Integrated Circuit Using Lanthanum-Modified Lead Zirconate Titanate Thin Films | No.50 |
| Lensless high-resolution photoacoustic imaging scanner for in vivo skin imaging | No.50 |
| Delay Fault Testing Using CloudTesting™ Services | No.50 |
| A New Method for Measuring Alias-Free Aperture Jitter in an ADC Output | No.49 |
| Fundamentals of quadrature modulation-demodulation and signal analysis | No.49 |
| A Jitter Separation and BER Estimation Method for Asymmetric Total Jitter Distributions | No.49 |
| Novel Crosstalk Evaluation Method for High-Density Signal Traces Using Clock Waveform Conversion Technique. | No.48 |
| Power Supply Impedance Emulation to Eliminate Overkills and Underkills due to the Impedance Difference between ATE and Customer Board | No.48 |
| An Optical Interconnection Test Method Applicable to 100-Gb/s Transceivers using an ATE based Hardware | No.48 |
| Known-Good-Die Test Methods for Large, Thin, High-Power Digital Devices | No.47 |
| Modeling of contact resistance at very small contact point | No.47 |
| A 10 MHz - 6 GHz High Power High Linearity 35 dB Digital Step Attenuator MMIC Using GaN HEMTs with TaON Passivation | No.46 |
| A Technique for Analyzing On-chip Power Supply Impedance | No.46 |
| Development of optical functional devices using epitaxially grown lanthanum-modified lead zirconate titanate films | No.45 |
| An ATE System for Testing 2.4-GHz RF Digital Communication Devices with QAM Signal Interfaces | No.45 |
| Statistical Silicon Results of Dynamic Power Integrity Control of ATE for Eliminating Overkills and Underkills | No.44 |
| Three dimensional profile measurement using multi-channel detector MVM-SEM | No.44 |
| An ATE Based 32 Gbaud PAM-4 At-Speed Characterization and Testing Solution | No.44 |
| A 10MHz-12GHz low-distortion high-speed SP4T switch using GaN HEMTs with oxynitride TaON passivation | No.43 |
| Development DC test technology with high additional value adopting digital controlled technology | No.43 |
| Static/Dynamic Characteristics Testing for capacitive Acceleration Sensor MEMS | No.43 |
| Advanced Method to Refine Waveform Smeared by Jitter in Waveform Sampler Measurement | No.43 |
| 30-Gb/s Optical and Electrical Test Solution for High-Volume Testing | No.42 |
| A New Method for Off-Chip or On-Die Timing Noise Measurement | No.42 |
| Time to Market Reduction from Pre-/Post-Silicon Verification to Production on ATE | No.42 |
| Power Integrity Control of ATE for Emulating Power Supply Fluctuations on Customer Environment | No.41 |
| Real-time photoacoustic imaging system for clinical burn diagnosis | No.41 |
| Low Cost Test Method for RF Communication Devices Using Equivalent EVM Approach | No.41 |
| A slim column cell of 12nm resolution for wider application of E-beam lithography | No.41 |
| High aspect wiring by the inkjet | No.41 |
| 8Gbps CMOS Pin Electronics Hardware Macro with Simultaneous Bi-directional Capability | No.40 |
| RNA: Advanced Phase Tracking Method for Digital Waveform Reconstruction | No.40 |
| Development of high-power pulsed fiber lasers | No.40 |
| The resonance adjustment methods for magnetically coupled resonance wireless power transfer | No.40 |
| VPCS "Vacuum probe contact system" | No.39 |
| Elegant Construction of SSC Implemented Signal by AWG And Organized Under-sampling of Wideband Signal | No.39 |
| Electro-optic and dielectric characterization of ferroelectric films for high-speed optical waveguide modulators | No.38 |
| Real-Time Testing Method for 16 Gbps 4-PAM Signal Interface | No.38 |
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